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Hua Fu Securities completed the capital increase and share expansion of over 4.7 billion yuan, and the Shanghai United Assets and Equity Exchange issued a closing announcement: the capital increase and share expansion project of Hua Fu Securities was launched. There were 17 participants in this capital increase, including 4 original shareholder units and 13 new investors, with a total investment of about 4.757 billion yuan. According to China, a brokerage firm, Hua Fu Securities' capital increase and share expansion has attracted wide attention in the market, becoming the largest equity financing case in the securities industry this year.Chief Economic Adviser of India: Continuing to support high-quality capital expenditure will be the driving force to maintain India's economic growth.Shanghai Minhang issued 50 opinions to promote high-quality industrial development and strengthen high-quality financial empowerment. The Minhang District People's Government of Shanghai issued the Policy Opinions on High-quality Industrial Development in Minhang District (Trial) on December 12, aiming at improving the basic industrial capacity and the modernization level of industrial chain, accelerating the concentration of various advanced production factors to the development of new-quality productive forces, and promoting the high-quality industrial development in Minhang District. The opinion proposes to strengthen the empowerment of high-quality finance, form a 30 billion yuan "special loan for high-quality development of enterprises in Minhang District", give preferential interest rates to loans, and give subsidies according to a certain proportion of loan interest. Form a credit line of 20 billion yuan "Minhang District Special Loan for Supporting New Infrastructure Construction" to give gradient support to various fixed assets projects.

Xia Yiping's internal letter was alleged to have been copied from Weilai Li Bin. Xia Yiping, CEO of Jiyue, released an internal letter on the afternoon of 11th, acknowledging that the company was encountering difficulties and needed to adjust immediately. Some netizens pointed out that part of Xia Yiping's internal letter copied the internal letter of Weilai Li Bin in 2023. Xia Yiping's internal letter mentioned that the following four things must be done well in the new entrepreneurial period: 1. Adhere to the long-term investment in core technologies to maintain the leading edge; 2. Strengthen sales and service capacity building to cope with fierce market competition; 3. Merge departments and posts with duplicate functions and change inefficient internal workflow; 4. Reduce projects that cannot improve financial performance in the short term. In 2023, Li Bin's internal letter also mentioned: ensure long-term investment in core key technologies and maintain the leading edge of technology and products; Ensure that sales and service capabilities can cope with fierce market competition; Ensure that 9 core products of 3 brands are listed as scheduled; Organize efficiency improvement, merge redundant departments and posts, change inefficient internal workflow and division of labor, and cancel inefficient posts; Improve the efficiency of resources, postpone and reduce the project investment that can not improve the company's financial performance within 3 years. (Sina Technology)Another member of South Korea's ruling party said he would vote to impeach President Yoon.Chief Economic Adviser of India: Continuing to support high-quality capital expenditure will be the driving force to maintain India's economic growth.

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)The weighted share price index of Taiwan Stock Exchange closed 0.6% higher at 23,046.80 points.Market News: NVIDIA has increased its recruitment in China, focusing on artificial intelligence to drive cars.